Work

Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

Year: 2001

Type: article

Source: Journal of Lightwave Technology

DOI: 10.1109/50.956142

Authors: M.H. Ayliffe, D.R. Rolston, A.E.L. Chuah, E. Bernier, F.S.J. Michael, D. Kabal, A.G. Kirk, D.V. Plant

Institutions: McGill University, Nortel (Canada)

Language: English

Topic: Semiconductor Lasers and Optical Devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: McGill University

OpenAlex ID: W2134286663

FWCI: 2.403

Cites: 41

Cited by: 6

Related to: 10