Work

Integrity analysis of solder joints; fracture mechanics approach

Year: 2002

Type: conference-paper

Source: IEEE/CPMT International Electronics Manufacturing Technology Symposium

DOI: 10.1109/emap.2001.984018

Authors: Dong-Hak Kim, Ki-Ju Kang, Youn-Young Earmme

Institutions: Chonnam National University, Korea Advanced Institute of Science and Technology

Language: English

Topic: Fatigue and fracture mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2136287459

FWCI:

Cites: 11

Cited by: 2

Related to: 10