Work

Effect of thermal gradients on the electromigration life-time in power electronics

Year: 2004

Type: conference-paper

Abstract: The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

Source: IEEE International Reliability Physics Symposium proceedings

DOI: 10.1109/relphy.2004.1315418

Authors: H.V. Nguyen, C. Salm, B. Krabbenborg, K. Weide-Zaage, J. Bisschop, A.J. Mouthaan, F.G. Kuper

Institution: University of Twente

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: green

OpenAlex ID: W2138118262

FWCI: 9.682

Cites: 6

Cited by: 34

Related to: 10