Work

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Year: 2012

Type: article

Source: Microsystem Technologies

DOI: 10.1007/s00542-012-1439-7

Authors: Viorel Dragoi, Eric Pabo, Jürgen Burggraf, Gerald Mittendorfer

Institution: EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2138563174

FWCI: 1.601

Cites: 14

Cited by: 35

Related to: 10