On-chip interconnect-aware design and modeling methodology, based on high bandwidth transmission line devices
Year: 2003
Type: conference-paper
Authors: D. Goren, M. Zelikson, R. Gordin, I. A. Wagner, A. Barger, A. Amir, B. Livshitz, A. Sherman, Y. Tretiakov, R. Groves, J. Park, D. Jordan, S. Strang, R. Singh, C. Dickey, D. Harame
Institutions: IBM Research - Haifa, IBM (United States)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2139021283