Work

Development of a novel air-back wafer carrier with an integrated endpoint detector for copper CMP application

Year: 2003

Type: conference-paper

Source: IEEE International Symposium on Semiconductor Manufacturing conference proceedings

DOI: 10.1109/issm.1999.808767

Authors: K. Sakai, T.K. Doy, M.M. Touzov, M. Satoh, T. Kasai

Institution: Saitama University

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2139078259

FWCI: 0.58

Cites: 1

Cited by: 3

Related to: 10