Excellent crystalline silicon surface passivation by amorphous silicon irrespective of the technique used for chemical vapor deposition
Year: 2011
Type: article
Abstract: Crystalline silicon surface passivation by amorphous silicon deposited by three different chemical vapor deposition (CVD) techniques at low (T∼130 °C) temperatures is compared. For all three techniques, surface recombination velocities (SRVs) are reduced by two orders of magnitude after prolonged thermal annealing at 200 °C. This reduction correlates with a decreased dangling bond density at the amorphous-crystalline interface, indicating that dangling bond saturation is the predominant mechanism. All three deposition methods yield excellent surface passivation. For a-Si:H layers deposited by radio frequency plasma enhanced CVD, we obtain outstanding carrier lifetimes of 10.3 ms, corresponding to SRVs below 1.32 cm/s.
Source: Applied Physics Letters
DOI: 10.1063/1.3579540
Institution: Utrecht University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: bronze
Funder: European Commission
OpenAlex ID: W2139162091
