Work

Development and evaluation of lead free reflow soldering techniques for the flip chip bonding of large GaAs pixel detectors on Si readout chip

Year: 2008

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2008.4550240

Authors: M. Klein, M. Hutter, H. Oppermann, T. Fritzsch, G. Engelmann, L. Dietrich, J. Wolf, B. Bramer, R. Dudek, H. Reichl

Institutions: Fraunhofer Institute for Reliability and Microintegration, Technische Universität Berlin

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2139583256

FWCI: 4.266

Cites: 9

Cited by: 10

Related to: 10