Work

Reliability of Flex Coatings for High-Performance Applications

Year: 1993

Type: article

Source: MRS Proceedings

DOI: 10.1557/proc-323-115

Authors: H. Tong, C. Wilson, T. Graham, L. Shi

Institution: IBM (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2139805491

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