Work

Investigation of non-uniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Year: 2005

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/esime.2005.1502784

Authors: Jiang Zhou, S.P. Lahoti, M.P. Sitlani, S.C. Kallolimath, R. Putta

Institution: Lamar University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2144801302

FWCI: 7.88

Cites: 9

Cited by: 37

Related to: 10