Work

Characterization and analysis on the solder ball shear testing conditions

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2001.927949

Authors: Xingjia Huang, S.-W.R. Lee, Chien Chun Yan, S. Hui

Institutions: Hong Kong University of Science and Technology, Stanford University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Hong Kong University of Science and Technology

OpenAlex ID: W2147802575

FWCI: 6.045

Cites: 18

Cited by: 74

Related to: 10