Work

Humidity and reflow resistance of flip chip on foil assemblies with conductive adhesive joints

Year: 2003

Type: article

Source: IEEE Transactions on Components and Packaging Technologies

DOI: 10.1109/tcapt.2003.817647

Authors: J. de Vries, E. Janssen

Institution: Philips (Netherlands)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2148183441

FWCI: 1.655

Cites: 10

Cited by: 13

Related to: 10