Work

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

Year: 2008

Type: article

Source: Applied Physics Letters

DOI: 10.1063/1.2912528

Authors: E. Chason, N. Jadhav, W. L. Chan, L. Reinbold, K. S. Kumar

Institutions: Brown University, University of Illinois Urbana-Champaign, Raytheon (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2149189709

FWCI: 8.163

Cites: 17

Cited by: 126

Related to: 10