Work

3D integration of image sensor SiP using TSV silicon interposer

Year: 2009

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2009.5416440

Authors: M. Juergen Wolf, K. Zoschke, A. Klumpp, R. Wieland, M. Klein, L. Nebrich, A. Heinig, I. Limansyah, W. Weber, O. Ehrmann, H. Reichl

Institutions: Fraunhofer Institute for Reliability and Microintegration, Fraunhofer-Gesellschaft, Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS, Fraunhofer Institute for Integrated Circuits, Infineon Technologies (Germany)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Bundesministerium für Bildung und Forschung

OpenAlex ID: W2152307346

FWCI: 7.027

Cites: 7

Cited by: 24

Related to: 10