Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging
Year: 2012
Type: article
Source: The Journal of Adhesion
Authors: Hui-wang Cui, Qiong Fan, Dong-sheng Li, Xin Tang
Institutions: Shanghai University, National Sun Yat-sen University
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2153201823