Work

Metal electromigration induced by solder flux residue in hybrid microcircuits

Year: 2003

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ecc.1988.12641

Authors: J.A. Weiner, R.C. Benson, B.M. Romenesko, B.H. Nall, H.K. Charles

Institutions: Johns Hopkins University, Johns Hopkins University Applied Physics Laboratory

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2153662467

FWCI: 1.297

Cites: 17

Cited by: 23

Related to: 10