Work

3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier

Year: 2011

Type: conference-paper

Source: IEEE International Symposium on Assembly and Manufacturing

DOI: 10.1109/isam.2011.5942362

Authors: Michael Pfeffer, Christian Goth, Daniel Craiovan, Jorg Franke

Institution: Friedrich-Alexander-Universität Erlangen-Nürnberg

Language: English

Topic: Manufacturing Process and Optimization

Subfield: Industrial and Manufacturing Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2154308183

FWCI: 3.939

Cites: 3

Cited by: 15

Related to: 10