Design considerations for implementing a modularly configured attached processor in a multi chip module
Year: 2002
Type: conference-paper
Authors: J.S. Singh, B.W. Gremel, V.P. Singh, G.A. Gibson
Institution: The University of Texas at El Paso
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2155294129