Low-Cost Technology for the Integration of Micro- and Nanochips into Fluidic Systems on Printed Circuit Board: Fabrication Challenges
Year: 2012
Type: article
Abstract: —Nowadays, micro- and nanochips are usually fabricated with Silicon and/or glass. A simple, low-cost and reliable integration packaging method that provides flexibility to the incorporation of electronic and fluidic devices into a system has not been fully developed yet. The use of Printed Circuit Board material as substrate to create dry film resist microfluidic channels is the core technology to provide such an integration method. The feasibility and potential of the proposed packaging method is demonstrated in this work.
Language: English
Subfield: Biomedical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: green
OpenAlex ID: W2155687121
