First CMOS integration of ultra thin body and BOX (UTB2) structures on bulk direct silicon bonded (DSB) wafer with multi-surface orientations
Year: 2009
Type: conference-paper
Authors: G. Bidal, F. Boeuf, S. Denorme, C. Laviron, K. Bourdelle, N. Loubet, Y. Campidelli, R. Beneyton, H. Moriceau, F. Fournel, P. Morin, S. Barnola, T. Salvetat, P. Perreau, P. Gouraud, F. Leverd, B. Le-Gratiet, J.L. Huguenin, D. Fleury, K. Kusiaku, A. Cros, C. Leyris, S. Haendler, C. Borowiak, L. Clement, R. Pantel, G. Ghibaudo, T. Skotnicki
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2156227010