Work

Prevention of Copper Interconnection Failure in System on Chip Using Virtual Metrology

Year: 2009

Type: article

Source: IEEE Transactions on Semiconductor Manufacturing

DOI: 10.1109/tsm.2009.2031757

Authors: S.-i. Imai, M. Kitabata

Institution: Panasonic (Japan)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2162225643

FWCI: 0.407

Cites: 15

Cited by: 23

Related to: 10