Work

Analysis of new anisotropic conductive film (ACF)

Year: 2005

Type: article

Source: IEEE Transactions on Device and Materials Reliability

DOI: 10.1109/tdmr.2005.860557

Authors: Chao-Ming Lin, Win-Jin Chang, Te-Hua Fang

Institutions: WuFeng University, Kun Shan University, National Formosa University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2166520108

FWCI: 0.922

Cites: 7

Cited by: 17

Related to: 10