Low-Temperature Direct Bonding of Borosilicate, Fused Silica, and Functional Coatings
Year: 2010
Type: conference-paper
Source: ECS Transactions
DOI: 10.1149/1.3483523
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2170021981
