Work

A new wafer-bonder of ultra-high precision using surface activated bonding (SAB) concept

Year: 2002

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc.2001.927935

Authors: T. Suga, M.M.R. Howlader, T. Itoh, C. Inaka, Y. Arai, A. Yamauchi

Institutions: Research Center for Advanced Science and Technology, The University of Tokyo, The University of Tokyo, Toray Engineering Co., Ltd. (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2170674643

FWCI: 2.629

Cites: 5

Cited by: 16

Related to: 10