Work

Compact thermal modeling of hot spots in advanced 3D-stacked ICs

Year: 2009

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2009.5416563

Authors: C. Torregiani, H. Oprins, B. Vandevelde, E. Beyne, I. De Wolf

Institutions: IMEC, KU Leuven

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W2171907321

FWCI: 7.183

Cites: 11

Cited by: 37

Related to: 10