Work

Structure decomposition for hybrid analysis of multilayer interconnect systems

Year: 2003

Type: conference-paper

Source: IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

DOI: 10.1109/epep.2002.1057900

Authors: N. Orhanovic, D. Divekar, N. Matsui

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2172201398

FWCI: 2.358

Cites: 8

Cited by: 7

Related to: 10