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Cu-Cu 열압착 웨이퍼 접합부의 계면접합강도에 미치는 N2+H2 분위기 열처리의 영향

Year: 2009

Type: article

Source: Journal of the Microelectronics and Packaging Society

Authors: Eun‐Jung Jang, Jaewon Kim, Bioh Kim, Thorsten Matthias, Seungmin Hyun, Hak‐Joo Lee, Young-Bae Park

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W218644371

FWCI: 0.258

Cites:

Cited by: 2

Related to: 10