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Encapsulation Technology for 3D Stacked Packages

Year: 2002

Type: conference-paper

Source: Pan Pacific Symposium

DOI: 10.37665/ppvlrqd15246

Authors: Horatio Quinones, Alec Babiarz, Liang fang, Yoshikazu Nakamura

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2187666804

FWCI:

Cites:

Cited by: 2

Related to: 10