Work

Can peel strength predict the structural integrity of the adhesive bond between the copper and laminate in a PCB

Year: 2004

Type: article

Authors: Patrick Brooks, Kuldip Johal, C. Sparing, Atotech Deutschland

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2188339669

FWCI:

Cites:

Cited by: 1

Related to: 10