Work

Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

Year: 2015

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2015.05.005

Authors: Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang

Institutions: Harbin University of Science and Technology, Delft University of Technology, Chinese Academy of Sciences, Institute of Semiconductors

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2201524976

FWCI: 0.699

Cites: 26

Cited by: 18

Related to: 10