Work

Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite

Year: 2013

Type: article

Source: Journal of Microelectronics and Electronic Packaging

DOI: 10.4071/imaps.371

Authors: M. Faqir, J. W. Pomeroy, T. Batten, T. Mrotzek, S. Knippscheer, O. Vendier, S. Rochette, M. Massiot, L. Letteron, J. M. Desmarres, F. Courtade, M. Kuball

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2250701293

FWCI:

Cites:

Cited by: 2

Related to: 10