Work

Adhesive joining of copper using nano-filler composite adhesive

Year: 2016

Type: article

Source: Polymer

DOI: 10.1016/j.polymer.2016.02.006

Authors: P.K. Ghosh, Avantak Patel, Kaushal Kumar

Institution: Indian Institute of Technology Roorkee

Language: English

Topic: Polymer Science and Applications

Subfield: Mechanical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: Department of Science and Technology, Ministry of Science and Technology, India, Indian Institute of Technology Roorkee, Department of Science and Technology, Government of Kerala, Science and Engineering Research Board

OpenAlex ID: W2261475673

FWCI: 3.841

Cites: 31

Cited by: 50

Related to: 10