Work

Solderability Challenges in Emerging BGA Packages

Year: 2014

Type: conference-paper

Source: Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

DOI: 10.4071/2014dpc-tp25

Authors: Maria Durham, Yan Liu, Andy Mackie

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2267608136

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