Work

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.

Year: 2013

Type: conference-paper

Source: Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

DOI: 10.4071/cicmt-tha41

Authors: Maren Bruder, Guenter Heinz, Mustafa Oezkoek

Institution: Atotech (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2269737481

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