Work

Comparative study on proper thermocouple attachment for vapour phase soldering profiling

Year: 2016

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-10-2015-0033

Authors: Attila Géczy, Bíborka Kvanduk, Balazs Illes, Gábor Harsányi

Institution: Budapest University of Technology and Economics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2279334753

FWCI: 1.831

Cites: 16

Cited by: 29

Related to: 10