Work

Pressureless Sintering of Nano- Ag Paste With Low Porosity for Die Attach

Year: 2014

Type: conference-paper

Source: IMAPSource Proceedings

DOI: 10.4071/isom-ta35

Authors: Sihai Chen, Guangyu Fan, Xue Yan, Chris LaBarbera, Lee Kresge, Ning-Cheng Lee

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2287065249

FWCI:

Cites: 2

Cited by: 2

Related to: 10