Work

Process characterization and reliability modeling of Rigid-Flex Printed Circuits (RFPCs)

Year: 2011

Type: dissertation

Source: PolyU Institutional Research Archive (Hong Kong Polytechnic University)

Author: Shiqing Huang

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2290937398

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