Work

3D & System-in-Package Development with the Redistributed Chip Package (RCP)

Year: 2012

Type: conference-paper

Source: Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

DOI: 10.4071/2012dpc-tha23

Authors: Zhiwei (Tony) Gong, Scott Hayes, Navjot Chhabra, Trung Duong, Doug Mitchell, Jason Wright, Michael Vincent

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2292252016

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