Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages
Year: 2016
Type: article
Authors: Yi He, Jun Li, Gengxin Tian, Fengman Liu, Liqiang Cao
Institutions: Chinese Academy of Sciences, Institute of Microelectronics
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G1241905224
OpenAlex ID: W2293740169