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The Higher Order Crack-Tip Fields for Anti-plane Crack in Exponential Functionally Graded Piezoelectric Materials

Year: 2015

Type: conference-paper

Abstract: The crack tip fields for anti-plane crack in functionally graded piezoelectric materials (FGPMs) under mechanical and electrical loadings are investigated.The elastic stiffness, piezoelectric parameter and dielectric permittivity of FGPMs are assumed to be exponential function of y perpendicular to the crack with different gradient parameters, respectively.By using the eigen-expansion method, the higher order crack tip stress and electric displacement fields for FGPMs are obtained.The analytic expressions of the stress intensity factors and the electric displacement intensity factors are derived.

Source: International Conference on Civil Engineering and Transportation (ICCET)

DOI: 10.2991/iccet-15.2015.363

Authors: Yao Dai, Xiao Chong, Jingwen Pan

Language: English

Topic: Fatigue and fracture mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: hybrid

Funder: National Natural Science Foundation of China

OpenAlex ID: W2302733252

FWCI:

Cites: 12

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Related to: 10