Work

3D Integration of System-in-Package (SiP): Toward SiP-Interposer-SiP for High-End Electronics

Year: 2013

Type: conference-paper

Source: Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

DOI: 10.4071/2013dpc-tp12

Authors: Rabindra Das, Frank D. Egitto, Steven G. Rosser, Erich Kopp, Barry Bonitz

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2319086470

FWCI:

Cites:

Cited by: 2

Related to: 10