Year: 1974
Type: conference-abstract
Abstract: The paper deals with a new process in the production of printed circuits. After pretreatment with a coupling agent, a conductive copper coating is vapour-deposited on the surface of the bare base material and in the holes of the board. This coating may then be increased by electroplating. All devices needed for bringing this deposition process into are described; explaining in detail the results of various investigations. As compared to other methods, vacuum deposition offers some decisivead vantages with reference to reduced etching times, improved environmental factors, savings in copper and less relief etching. The process described herein allows the manufacture of even the most intricate printed circuit boards.
Authors: Werner Fleischer, Klaus Petzold, Helmut Bollinger, Elimar Goring
Language: English
Subfield: Surfaces, Coatings and Films
Field: Materials Science
Domain: Physical Sciences
Open Access status: bronze
OpenAlex ID: W2321775484