Work

Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding

Year: 2010

Type: conference-paper

Source: ECS Transactions

DOI: 10.1149/1.3483540

Authors: Frank Fournel, Laurent Bally, Don Dussault, Viorel Dragoi

Institutions: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, CEA Grenoble, Laboratoire d'Électronique des Technologies de l'Information, EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2322745720

FWCI: 1.711

Cites:

Cited by: 6

Related to: 10