Work

Chemical Vapor Deposition of Copper for IC Metallization: Precursor Chemistry and Molecular Structure

Year: 1994

Type: article

Source: MRS Bulletin

DOI: 10.1557/s0883769400047722

Authors: Pascal Doppelt, Thomas H. Baum

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2327222575

FWCI: 7.512

Cites: 86

Cited by: 72

Related to: 10