Work

(Invited) High Speed Copper Electrodeposition for Through Silicon Via(TSV)

Year: 2012

Type: conference-paper

Source: ECS Transactions

DOI: 10.1149/1.4717502

Authors: Taro Hayashi, Kazuo Kondo, Minoru Takeuchi, Yushi Suzuki, Takeyasu Saito, Naoki Okamoto, Masao Marunaka, Takayuki Tsuchiya, Masaru Bunya

Institutions: Osaka Prefecture University, Nitto Boseki (Japan), Shinmaywa Industries, Ltd. (Japan)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2328869864

FWCI: 0.405

Cites:

Cited by: 2

Related to: 10