Work

A grey-ANN approach for optimizing the QFN component assembly process for smart phone application

Year: 2016

Type: article

Source: Soldering and Surface Mount Technology

DOI: 10.1108/ssmt-10-2015-0034

Authors: Chien-Yi Huang, Ching-Hsiang Chen, Yueh-Hsun Lin

Institution: National Taipei University of Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W2337847331

FWCI: 0.429

Cites: 45

Cited by: 11

Related to: 10