Work

高圧アニールプロセスでの銅配線熱応力評価 (特集:薄膜技術)

Year: 2002

Type: article

Source: R&D神戸製鋼技報

Authors: 隆夫井上, 亜希宮垣, 隆大西

Language: Japanese

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W234420575

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