Work

Fabrication of copper/single-walled carbon nanotube composite film with homogeneously dispersed nanotubes by electroless deposition

Year: 2016

Type: article

Abstract: Copper/single-walled carbon nanotube (SWCNT) composite films were fabricated by electroless deposition. The SWCNTs were formed using the water-assisted chemical vapor deposition method. To prepare copper/SWCNT composite plating baths with homogeneously dispersed SWCNTs, magnetic stirring, ultrasonic homogenization, and collision-type atomization were examined as mechanical methods for the disintegration of SWCNT bundles. Appropriate dispersants were added to the plating baths to avoid re-aggregation of the disintegrated SWCNTs. The degree of SWCNT dispersion in the copper/SWCNT composite plating bath was evaluated using a particle size analyzer, and the microstructures of the copper/SWCNT composite films were analyzed using scanning electron microscopy and X-ray diffraction. Collision-type atomization most significantly improved the degree of SWCNT dispersion in the composite plating bath. Using this treatment method, copper/SWCNT composite films with homogeneous dispersions of SWCNTs were successfully fabricated by electroless deposition.

Source: Materials Today Communications

DOI: 10.1016/j.mtcomm.2016.04.009

Authors: Susumu Arai, Takuma Osaki, Mitsuhito Hirota, Mitsugu Uejima

Institutions: Shinshu University, Zeon (Japan)

Language: English

Topic: Electrodeposition and Electroless Coatings

Subfield: Surfaces, Coatings and Films

Field: Materials Science

Domain: Physical Sciences

Open Access status: hybrid

Estimated APC paid: $2,830

Funder: Japan Society for the Promotion of Science