Work

No clean material for advance packaging assembly

Year: 2016

Type: conference-paper

Source: China Semiconductor Technology International Conference (CSTIC)

DOI: 10.1109/cstic.2016.7464050

Authors: SzePei Lim, Maria Durham, Andy Mackie

Institution: Indium Corporation (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2360840686

FWCI: 0.464

Cites: 2

Cited by: 1

Related to: 10