The Influence of Buried Oxide Layer on the SOI and Glass Bonding and the Improvement of Bonding Equipment
Year: 2012
Type: article
Source: Journal of Xiamen University
Author: Feng Yong-jian
Institution: Xiamen University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2383536741